TE Connectivity AMPMODU System 50 Interconnection System

AMPMODU System 50 Interconnection System with a compact space saving design and high density 1.27 x 2.54 mm contact spacing for use in high density applications. The AMPMODU System 50 connector system consists of PCB headers, PCB receptacles and wire to board IDC ribbon cable connectors. These connectors are available in various configurations making the AMPMODU System 50 connector system suitable for a wide range of applications. The contacts of the AMPMODU System 50 connectors are made from high conductivity copper alloy with selective gold plating for high electrical performance and reliability.

TE Connectivity 1.27mm x 2.54mm AMPMODU System 50 Board to Board Headers

AMPMODU System 50 1.27 x 2.54mm shrouded and unshrouded board to board PCB header connectors with a high density design for PCB space saving. The housings of these AMPMODU System 50 1.27 x 2.54mm headers are made from high termperature thermoplastic with a polarized design to aid alignment to mating connectors and stand-offs for drainage. The unshrouded versions of these AMPMODU System 50 headers allow for the close stacking of daughter cards. These AMPMODU System 50 1.27 x 2.54mm board to board headers are available in a variety of configurations, single row, double row, vertical, right angle, through hole and SMT
Part numbers x-104074-x and x-104069-x have solder clips / PCB hold down posts.